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power management & multimarket data sheet revision 1.3, 2015-07-13 final esd101-b1-02 series bi-directional, 5.5 v, 0.1 pf, 0201, 0402, rohs and halo gen free compliant ESD101-B1-02ELs ESD101-B1-02EL protection device tvs (transient voltage suppressor)
edition 2015-07-13 published by infineon technologies ag 81726 munich, germany ? 2015 infineon technologies ag all rights reserved. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ) warnings due to technical requirements, components may contain dangerous substances. for in formation on the types in question, please contact the neares t infineon technologies office. infineon technologies components may be used in life-suppo rt devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or sys tem. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if t hey fail, it is reasonable to assume that the health of the user or other persons may be endangered.
esd101-b1-02 series product overview final data sheet 3 revision 1.3, 2015-07-13 1 product overview 1.1 features ? esd / transient protection of high speed data lines according to: ? iec61000-4-2 (esd): 14 kv (air), 12 kv(contact) ? iec61000-4-4 (eft): 1.5 kv / 30 a (5/50 ns) ? iec61000-4-5 (surge): 2 a (8/20 s) ? bi-directional working voltage up to: v rwm =5.5v ? extremely low capacitance c l = 0.1 pf (typical) at f =1ghz ? very low clamping voltage: v cl =30v (typical) at i tlp =16a ? very low reverse current: i r <0.1na ? very low dynamic resistance: r dyn =1.5 ? (typical) ? pb-free package (rohs compliant) 1.2 application examples [3] ? tailored for esd protection of capa citance-susceptible application like ? super high speed interface ? rf antenna 1.3 product description figure 1 pin configuration and schematic diagram table 1 part information type package configuration marking code ESD101-B1-02ELs tsslp-2-4 1 line, bi-directional r ESD101-B1-02EL tslp-2-20 1 line, bi-directional r pinconf_and_schematicdiag.vsd pin 1 pin 2 pin 1 pin 2 pin 1 marking (lasered)
esd101-b1-02 series maximum ratings final data sheet 4 revision 1.3, 2015-07-13 2 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 3 electrical characteristics at t a = 25 c, unless otherwise specified figure 2 definitions of electrical characteristics table 2 maximum rating at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit esd air discharge 2) esd contact discharge 2) 2) v esd according to iec61000-4-2 v esd 14 12 kv peak pulse power p pk 30 w peak pulse current 3) 3) non-repetitive current pulse 8/20 s exponential decay waveform according to iec61000-4-5 i pp 2 a operating temperature t op -55 to 125 c storage temperature t stg -65 to 150 c

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esd101-b1-02 series electrical characteristics at t a = 25 c, unless otherwise specified final data sheet 5 revision 1.3, 2015-07-13 table 3 dc characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. reverse working voltage v rwm -5.5 ? 5.5 v trigger voltage v t1 6.1 ? ? holding voltage v h 6.1 7.0 7.9 i t =10ma reverse leakage current i r ?<0.120na v r =5.5v table 4 ac characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. line capacitance c l ??0.2pf v r =0v, f =1mhz ?0.1? v r =0v, f = 1 ghz serie inductance l s ? ? 0.2 0.4 ? ? nh ESD101-B1-02ELs ESD101-B1-02EL table 5 esd and surge characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. clamping voltage 2) 2) please refer to application note an210 [1] . tlp parameter: z 0 = 50 , t p = 100ns, t r = 300ps. v cl ?18?v i tlp =8a, t p = 100 ns ?30? i tlp =16a, t p =100ns clamping voltage 3) 3) non-repetitive current pulse 8/20s exponent ial decay waveform according to iec61000-4-5 ?9? i pp =1a, t p =8/20 s ?13? i pp =2a, t p =8/20 s dynamic resistance 2) r dyn ?1.5? t p =100ns
esd101-b1-02 series typical characteristics diagrams final data sheet 6 revision 1.3, 2015-07-13 4 typical characteristics diagrams typical characteristics diagrams at t a = 25c, unless otherwise specified figure 3 reverse leakage current: i r = f ( v r ) figure 4 line capacitance c l = f ( v r ), f =1ghz 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 0 1 2 3 4 5 i r [a] v r [v] 0 25 50 75 100 125 150 -5 -4 -3 -2 -1 0 1 2 3 4 5 c l [ff] v r [v]
esd101-b1-02 series typical characteristics diagrams final data sheet 7 revision 1.3, 2015-07-13 figure 5 clamping voltage (esd): v cl = f ( t ), 8 kv positive pulse from pin 1 to pin 2 figure 6 clamping voltage (esd): v cl = f ( t ), 8 kv negative pulse from pin 1 to pin 2 -50 0 50 100 150 200 250 300 350 -50 0 50 100 150 200 250 300 350 400 450 v cl [v] t p [ns] scope: 20 gs/s v cl-max-peak = 300 [v] v cl-30ns-peak = 25 [v] -350 -300 -250 -200 -150 -100 -50 0 50 -50 0 50 100 150 200 250 300 350 400 450 v cl [v] t p [ns] scope: 20 gs/s v cl-max-peak = -304 [v] v cl-30ns-peak = -19 [v]
esd101-b1-02 series typical characteristics diagrams final data sheet 8 revision 1.3, 2015-07-13 figure 7 clamping voltage (tlp): i tlp = f ( v tlp ) [1] , pin 1 to pin 2 -20 -15 -10 -5 0 5 10 15 20 -40 -30 -20 -10 0 10 20 30 40 -10 -7.5 -5 -2.5 0 2.5 5 7.5 10 i tlp [a] equivalent v iec [kv] v tlp [v] esd101-b1-02eseries r dyn r dyn = 1.5 r dyn = 1.5
esd101-b1-02 series typical characteristics diagrams final data sheet 9 revision 1.3, 2015-07-13 figure 8 clamping voltage (surge): i pp = f ( v cl ) [1] , pin 1 to pin 2 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 -15 -10 -5 0 5 10 15 i pp [a] v cl [v]
esd101-b1-02 series typical characteristics diagrams final data sheet 10 revision 1.3, 2015-07-13 figure 9 insertion loss vs. frequency in a 50 ? system (ESD101-B1-02ELs) -5 -4 -3 -2 -1 0 0.1 1 10 insertion loss [db] f [ghz]
esd101-b1-02 series package information final data sheet 11 revision 1.3, 2015-07-13 5 package information 5.1 tsslp-2-4 figure 10 tsslp-2-4 package outline (dimension in mm) figure 11 tsslp-2-4 footprint (dimension in mm) figure 12 tsslp-2-4 packing (dimension in mm) figure 13 tsslp-2-4 marking example table 1 ?part information? on page 3 tsslp-2-3, -4-po v01 0.05 0.32 1 2 0.035 0.2 1) 0.62 0.05 +0.01 0.31 -0.02 1) dimension applies to plated terminals pin 1 marking 1) 0.035 0.26 0.05 max. bottom view top view 0.355 0.27 0.19 0.19 0.19 copper solder mask stencil apertures 0.57 0.24 0.62 0.32 0.24 0.14 tsslp-2-3, -4-fp v02 ex 4 ey 0.35 pin 1 marking 8 marking tsslp-2-3, -4-tp v03 deliveries can be both tape types (no selection possible). specification allows identical processing (pick & place) by users. ex ey punched tape tape type embossed tape 0.43 0.73 0.37 0.67 pin 1 marking 1 type code
esd101-b1-02 series package information final data sheet 12 revision 1.3, 2015-07-13 5.2 tslp-2-20 figure 14 tslp-2-20 package outline (dimension in mm) figure 15 tslp-2-20 footprint (dimension in mm) figure 16 tslp-2-20 packing (dimension in mm) figure 17 tslp-2-20 marking example table 1 ?part information? on page 3 tslp-2-19, -20-po v01 0.05 0.6 1 2 0.05 0.65 0.035 0.25 1) 1 0.05 0.05 max. +0.01 0.31 -0.02 1) dimension applies to plated terminals pin 1 marking 1) 0.035 0.5 bottom view top view tslp-2-19, -20-fp v01 0.45 0.28 0.28 0.38 0.93 copper solder mask stencil aperture s 0.35 1 0.6 0.35 0.3 0.76 4 1.16 0.4 pin 1 marking 8 tslp-2-19, -20-tp v02 type code pin 1 marking tslp-2-19, -20-mk v01 12
esd101-b1-02 series references final data sheet 12 revision 1.3, 2015-07-13 references [1] infineon technologies ag, ?effective esd prot ection design at system level using vf-tlp characterization methodology?, application note an210 , rf and protection devices, april 22, 2010, rev.1.0 [2] infineon ag - recommendations for pcb a ssembly of infineon tslp and tsslp packages [3] infineon ac - application note an327 : esd101-b1 / esd103-b1, bi-directional ultra low capacitance transient voltage suppression diode s for high power rf applications.
esd101-b1-02 series final data sheet 13 revision 1.3, 2015-07-13 trademarks of infineon technologies ag aurix?, bluemoon?, comneon? , c166?, crossave?, canpak?, ci pos?, coolmos?, coolset?, corecontrol?, dave?, easypim?, econobridg e?, econodual?, eco nopack?, econopim?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, isofac e?, i2rf?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, profet?, pro-sil?, primarion?, primepack? , rasic?, reversave?, satric?, sieget?, sindr ion?, smarti?, smartlewis?, tempfet?, thin q!?, tricore?, trenchstop?, x-gold?, xmm?, x-pmu?, xposys?. other trademarks advance design system? (ads) of agilent tech nologies, amba?, arm?, mu lti-ice?, primecell?, realview?, thumb? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus? , firstgps? of trimble navigation ltd. emv? of emvco, llc (visa holdings inc.). ep cos? of epcos ag. flexgo? of microsoft corporation. flexray? is licensed by flexra y consortium. hyperterminal? of hilgraeve incorpor ated. iec? of commission electrotechnique internationale. irda? of infrared data association corporation. iso? of international organization for standardizati on. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. mi crotec?, nucleus? of mentor graphi cs corporation. mifare? of nxp. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of si rius sattelite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektro nix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilo g?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorpor ated. vxworks?, wind river? of wind ri ver systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-06-09 revision history: rev. .1.2, 2013-07-23 page or item subjects (major changes since previous revision) revision 1.3, 2015-07-13 all layout changes 5 table 3-1) updated
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